Thermoelectric module

ABSTRACT

A thermoelectric module according to the present invention includes a first support substrate including a principal surface that includes a first region and a second region that is adjacent to the first region; a second support substrate including a principal surface that faces the first region; a plurality of thermoelectric elements arranged between the first region and the principal surface of the second support substrate; and a temperature detection element mounted in the second region. The temperature detection element and the second support substrate are thermally connected to each other by a thermally conductive member.

TECHNICAL FIELD

The present invention relates to thermoelectric modules used fortemperature control or thermoelectric power generation, such as wasteheat power generation, in, for example, thermostatic chambers,refrigerators, seat coolers for automobiles, semiconductor manufacturingdevices, laser diodes, or fuel cells.

An example of a thermoelectric module is described in, for example,Japanese Unexamined Patent Application Publication No. 2007-294864(hereinafter referred to as Patent Document 1). The thermoelectricmodule described in Patent Document 1 includes a first supportsubstrate, a second support substrate that faces the first supportsubstrate, and a plurality of thermoelectric elements disposed betweenthe first support substrate and the second support substrate.

Thermoelectric modules are capable of generating a temperaturedifference between a support substrate and another support substratewhen a voltage is applied to a plurality of thermoelectric elements. Thethermoelectric modules are also capable of generating electric powerwith a plurality of thermoelectric elements when a temperaturedifference is applied between a support substrate and another supportsubstrate. Owing to these characteristics, the thermoelectric modulesare used, for example, for temperature control or thermoelectric powergeneration.

The thermoelectric module described in Patent Document 1 furtherincludes a temperature detection element on the inner surface of thefirst support substrate (surface that faces the second supportsubstrate). The temperature detection element detects the temperature ofthe first support substrate.

In the thermoelectric module described in Patent Document 1, since thetemperature detection element is provided on the inner surface of thefirst support substrate, when the temperature of the first supportsubstrate changes, the temperature change can be quickly detected.However, when the temperature of the second support substrate changes,since the heat of the second support substrate is transferred to thetemperature detection element through the thermoelectric elements andthe first support substrate, it takes a long time to detect thetemperature change. As a result, when the thermoelectric module is usedfor temperature control, it takes a long time to control thetemperature. When the thermoelectric module is used for thermoelectricpower generation, it takes a long time to adjust the heat transferred tothe thermoelectric module, and the power generation efficiency of thethermoelectric module may be reduced.

SUMMARY OF INVENTION

A thermoelectric module according to an aspect of the present inventionincludes a first support substrate including a principal surface thatincludes a first region and a second region that is adjacent to thefirst region; a second support substrate including a principal surfacethat faces the first region; a plurality of thermoelectric elementsarranged between the first region and the principal surface of thesecond support substrate; and a temperature detection element mounted inthe second region. The temperature detection element and the secondsupport substrate are thermally connected to each other by a thermallyconductive member.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is an exploded perspective view of a thermoelectric moduleaccording to an embodiment of the present invention.

FIG. 2 is a perspective view of the thermoelectric module illustrated inFIG. 1.

FIG. 3 is a plan view of the thermoelectric module illustrated in FIG.1.

FIG. 4 is a sectional view of the thermoelectric module illustrated inFIG. 2 taken along line A-A′.

FIG. 5 is a partial sectional view of the thermoelectric moduleillustrated in FIG. 2 taken along line B-B′.

FIG. 6 is a partial sectional view of a thermoelectric module accordingto a first modification of the present invention.

FIG. 7 is a partial sectional view of a thermoelectric module accordinga second modification of the present invention.

DESCRIPTION OF EMBODIMENTS

A thermoelectric module 10 according to an embodiment of the presentinvention will be described in detail with reference to the drawings.

As illustrated in FIG. 1, the thermoelectric module 10 according to theembodiment of the present invention includes a first support substrate1, a second support substrate 2 that faces the first support substrate1, thermoelectric elements 3 disposed between a principal surface of thefirst support substrate 1 and a principal surface of the second supportsubstrate 2, and a temperature detection element 4 mounted on the firstsupport substrate 1. In FIG. 1, the thermoelectric module 10 is shown ina partially exploded view for the convenience of description. Althoughnot illustrated in FIG. 1, as illustrated in FIG. 2, the thermoelectricmodule 10 further includes a thermally conductive member 5 thatthermally connects the temperature detection element 4 to the secondsupport substrate 2 and a sealing member 8 that seals the thermoelectricelements 3. In FIG. 2, the thermally conductive member 5 is shown in atransparent view to clarify the positional relationship between thetemperature detection element 4 and the thermally conductive member 5.

<Structure of First Support Substrate 1>

The first support substrate 1 is basically a component for supportingthe thermoelectric elements 3 together with the second support substrate2. As illustrated in FIG. 1, the first support substrate 1 is arectangular member having a first region 11 and a second region 12,which is adjacent to the first support substrate 1, on the principalsurface that faces the second support substrate 2 (hereinafter referredto also as a top surface). The first region 11 extends from an end ofthe first support substrate 1 over a major portion of the principalsurface, and serves as a region in which the first support substrate 1supports the thermoelectric elements 3 together with the second supportsubstrate 2 that faces the first support substrate 1.

The second region 12 is a region of the first support substrate 1excluding the first region 11, and is adjacent to the first region 11.The second region 12 is a region in which the temperature detectionelement 4 is provided.

With regard to the dimensions of the first support substrate 1 of thethermoelectric module 10 according to the present embodiment, the depth,width, and thickness may be set to, for example, 10 to 120 mm, 10 to 50mm, and 0.1 to 5 mm, respectively.

A first electrode 6 is provided on the top surface of the first supportsubstrate 1. Therefore, at least the top surface of the first supportsubstrate 1 is made of an insulating material. The first supportsubstrate 1 may be a substrate obtained by, for example, bonding acopper plate for transferring or radiating heat to the outside to abottom principal surface of an epoxy resin plate to which alumina filleris added or a ceramic plate made of, for example, an aluminum oxidesintered body or an aluminum nitride sintered body. Alternatively, thefirst support substrate 1 may be a substrate obtained by providing aninsulating layer made of an epoxy resin, a polyimide resin, an aluminaceramic, an aluminum nitride ceramic, or the like on the top surface ofa copper plate, a silver plate, or a silver-palladium plate.

<Structure of First Electrode 6>

The first electrode 6 is a component for applying electric power to thethermoelectric elements 3 or extracting electric power generated by thethermoelectric elements 3. As illustrated in FIG. 4, the first electrode6 is on the top surface of the first support substrate 1. The firstelectrode 6 electrically connects the thermoelectric elements 3 togetherwith a second electrode on the bottom surface of the second supportsubstrate 2. More specifically, p-type thermoelectric elements 31 andn-type thermoelectric elements 32, which are adjacent to each other, arealternately electrically connected in series, and all of thethermoelectric elements 3 are connected in series. The first electrode 6is made of, for example, copper, silver, or silver-palladium. The firstelectrode 6 is formed by, for example, bonding a copper plate to the topsurface of the first support substrate 1, placing a mask on the copperplate to cover regions corresponding to the first electrode 6, andremoving, by etching, portions of the copper plate in regions other thanthe regions covered with the mask. The first electrode 6 may instead beformed by bonding a copper plate that is formed by a punching processand that has a shape corresponding to the shape of the first electrode 6to the first support substrate 1.

<Structure of Second Support Substrate 2>

The second support substrate 2 is basically a component for supportingthe thermoelectric elements 3 by sandwiching the thermoelectric elements3 together with the first support substrate 1. The second supportsubstrate 2 is arranged such that the principal surface thereof(hereinafter referred to also as a bottom surface) faces the firstregion 11 of the first support substrate 1. The bottom surface of thesecond support substrate 2 and the first region 11 of the top surface ofthe first support substrate 1 sandwich and support the thermoelectricelements 3. The second support substrate 2 has, for example, arectangular shape. The dimensions of the second support substrate 2 areset such that the second support substrate 2 can support thethermoelectric elements 3 together with the first region 11 of the firstsupport substrate 1. More specifically, when the second supportsubstrate 2 has a rectangular shape, the depth, width, and thickness maybe set to, for example, 8 to 100 mm, 10 to 50 mm, and 0.1 to 5 mm,respectively. In the thermoelectric module 10 according to the presentembodiment, the principal surface of the second support substrate 2 andthe first region 11 of the first support substrate 1 have the same shapeand dimensions, and entirely overlap in plan view. Accordingly, thedurability of the thermoelectric module 10 against a vertical forceapplied thereto is increased.

A second electrode 7 is provided on the principal surface (bottomsurface) of the second support substrate 2 that faces the first supportsubstrate 1. Therefore, at least the bottom surface of the secondsupport substrate 2 is made of an insulating material. The secondsupport substrate 2 may be composed of a member similar to theabove-described member that can be used as the first support substrate1.

<Structure of Second Electrode 7>

The second electrode 7 is a component for applying electric power to thethermoelectric elements 3 or extracting electric power generated by thethermoelectric elements 3. As illustrated in FIG. 4, the secondelectrode 7 is on the bottom surface of the second support substrate 2.The second electrode 7 electrically connects the thermoelectric elements3 together with the first electrode 6. More specifically, the p-typethermoelectric elements 31 and the n-type thermoelectric elements 32,which are adjacent to each other, are alternately electrically connectedin series, and all of the thermoelectric elements 3 are connected inseries. The second electrode 7 is made of, for example, copper, silver,or silver-palladium. The second electrode 7 is formed by, for example,bonding a copper plate to the bottom surface of the second supportsubstrate 2, placing a mask on the copper plate to cover regionscorresponding to the second electrode 7, and etching portions of thecopper plate in regions other than the regions covered with the mask.The second electrode 7 may instead be formed by bonding a copper platethat is formed by a punching process and that has a shape correspondingto the shape of the second electrode 7 to the bottom surface of thesecond support substrate 2.

<Structure of Thermoelectric Elements 3>

The thermoelectric elements 3 are components for performing temperaturecontrol by utilizing the Peltier effect or generating electric power byutilizing the Seebeck effect. The thermoelectric elements 3 are arrangedbetween the first region 11 of the principal surface of the firstsupport substrate 1 and the principal surface of the second supportsubstrate 2. The thermoelectric elements 3 are arrayed with intervalstherebetween, the intervals being 0.5 to 2 times the diameter of thethermoelectric elements 3. The thermoelectric elements 3 are bonded tothe first electrode 6 with solder applied in a pattern similar to thepattern of the first electrode 6. All of the thermoelectric elements 3are electrically connected in series by the first electrode 6 and thesecond electrode 7.

The thermoelectric elements 3 are classified into the p-typethermoelectric elements 31 and the n-type thermoelectric elements 32.The main portions of the thermoelectric elements 3 (p-typethermoelectric elements 31 and n-type thermoelectric elements 32) areformed of a thermoelectric material composed of A₂B₃-type crystal (A isBi and/or Sb, and B is Te and/or Se), preferably, a Bi (bismuth)-basedor Te (tellurium)-based thermoelectric material. More specifically, thep-type thermoelectric elements 31 are made of, for example, athermoelectric material composed of a solid solution of Bi₂Te₃ (bismuthtelluride) and Sb₂Te₃ (antimony telluride). The n-type thermoelectricelements 32 are made of, for example, a thermoelectric material composedof a solid solution of Bi₂Te₃ (bismuth telluride) and Sb₂Se₃ (antimonyselenide).

The thermoelectric material of the p-type thermoelectric elements 31 isobtained by coagulating a p-type formation material, composed ofbismuth, antimony, and tellurium that have been melted and thensolidified, in a certain direction into a rod shape by the Bridgmanmethod. The thermoelectric material of the n-type thermoelectricelements 32 is obtained by coagulating an n-type formation material,composed of bismuth, tellurium, and selenium that have been melted andthen solidified, in a certain direction into a rod shape by the Bridgmanmethod.

The rod-shaped thermoelectric materials are coated with a resist toprevent the side surfaces thereof from being plated, and are cut intopieces having a length of, for example, 0.3 to 5 mm with a wire saw.Then, a nickel layer and a tin layer are successively formed only on thecut surfaces by electroplating. Finally, the resist is removed with asolution. Thus, the thermoelectric elements 3 (p-type thermoelectricelements 31 and n-type thermoelectric elements 32) are obtained.

The thermoelectric elements 3 (p-type thermoelectric elements 31 andn-type thermoelectric elements 32) may have, for example, a columnarshape, a rectangular prism shape, or a polygonal prism shape. Inparticular, the thermoelectric elements 3 are preferably columnarshaped. In this case, the influence of thermal stress generated in thethermoelectric elements 3 in heat cycles can be reduced. In the casewhere the thermoelectric elements 3 are formed in a columnar shape, thedimensions thereof may be set such that, for example, the diameter is 1to 3 mm.

<Structure of Temperature Detection Element 4>

The temperature detection element 4 is a component for measuring thetemperature of the thermoelectric module 10. As illustrated in FIGS. 3and 5, the temperature detection element 4 is mounted on the ceramicbody 1 in the second region 12. Since the temperature detection element4 is in the second region 12, the temperature detection element 4 can beeasily mounted even when the thickness thereof is greater than thedistance between the top surface of the first support substrate 1 andthe bottom surface of the second support substrate 2.

The temperature detection element 4 is, for example, a polymer-based PTCthermistor containing carbon particles. When the temperature becomesgreater than or equal to a threshold, the temperature detection element4 suddenly thermally expands. Accordingly, the polymer thermally expandsand the inter-particle distance between the carbon particles increases,so that the electrical resistance increases. The temperature detectionelement 4 is electrically connected to the first electrode 6. Thetemperature detection element 4 includes an electrode portion that isbonded to the first electrode 6 with a solder material. In the presentembodiment, the temperature detection element 4 is electricallyconnected to the thermoelectric elements 3 in series. In the case wherethe temperature detection element 4 has a rectangular parallelepipedshape, the dimensions of the temperature detection element 4 may be setsuch that the depth, width, and thickness are 0.5 to 5 mm, 1.5 to 8 mm,and 0.3 to 2 mm, respectively.

<Structure of Sealing Member 8>

The sealing member 8 is a component for airtightly sealing thethermoelectric elements 3 in the space between the first supportsubstrate 1 and the second support substrate 2 that face each other. Asillustrated in FIGS. 2, 4, and 5, the sealing member 8 is disposedbetween a peripheral portion of the first region 11 of the principalsurface of the first support substrate 1 and the principal surface ofthe second support substrate 2. The sealing member 8 surrounds all ofthe thermoelectric elements 3. Namely, the sealing member 8 has anannular shape and is disposed between the first region 11 of the firstsupport substrate 1 and the second support substrate 2. The sealingmember 8 is made of, for example, a resin material such as an epoxy. Thethickness of the sealing member 8 in a direction parallel to theprincipal surface of the first support substrate 1 may be set to, forexample, about 0.5 to 2 mm. Since the sealing member 8 is provided, theenvironmental resistance of the thermoelectric elements 3 can beincreased.

<Structure of Thermally Conductive Member 5>

The thermally conductive member 5 is a component for transferring heatof the second support substrate 2 to the temperature detection element4. The temperature detection element 4 and the second support substrate2 are thermally connected to each other by the thermally conductivemember 5. As illustrated in FIGS. 2, 3 and 5, the thermally conductivemember 5 covers the temperature detection element 4 and is in contactwith the second support substrate 2. More specifically, the thermallyconductive member 5 covers the entirety of the temperature detectionelement 4 and is in contact with a side surface of the second supportsubstrate 2. The cross section of the thermally conductive member 5 in adirection parallel to the principal surface of the first supportsubstrate 1 decreases from the first support substrate 1 toward thesecond support substrate 2. Herein, the “thermally connected” statemeans a state in which, since the thermally conductive member 5 isprovided, heat is more easily transferred between the second supportsubstrate 2 and the temperature detection element 4 than in the casewhere the thermally conductive member 5 is not provided.

The thermally conductive member 5 is formed of a member that has a highthermal conductivity and that is highly adhesive to the second supportsubstrate 2 and the temperature detection element 4. The thermallyconductive member 5 is made of, for example, a resin material such as anepoxy resin or a silicone resin. In the case where a resin material isused as the material of the thermally conductive member 5, the thermallyconductive member 5 may be formed by supplying the material to a regionaround the temperature detection element 4 with a dispenser or the like,and then curing the material with heat or moisture. When a siliconeresin is used as the material of the thermally conductive member 5, thethermal conductivity may be set to about 4 W/(m·K).

The thermally conductive member 5 is preferably formed of a resinmaterial and thermally conductive particles having a thermalconductivity higher than that of the resin material. More specifically,when a silicone material is used as the resin material, particles of ametal, such as SnSb, having a high thermal conductivity may be dispersedin the silicone resin as the thermally conductive particles. In such acase, the thermal conductivity can be further increased while theadhesiveness of the thermally conductive member 5 is maintained. Inparticular, when the above-described metal particles are denselydistributed in a region around the temperature detection element 4, heatcan be easily transferred to the temperature detection element 4.

In the thermoelectric module 10 according to the present embodiment, thetemperature detection element 4 and the second support substrate 2 arethermally connected to each other by the thermally conductive member 5.Therefore, a temperature change can be quickly detected not only whenthe temperature of the first support substrate 1 has changed but alsowhen the temperature of the second support substrate 2 has changed. As aresult, when the thermoelectric module 10 is used for temperaturecontrol, the time required for the temperature control can be reduced.When the thermoelectric module 10 is used for thermoelectric powergeneration, the heat transferred to the thermoelectric module 10 can bequickly adjusted, so that the reduction in the power generationefficiency of the thermoelectric module 10 can be suppressed.

In addition, in the thermoelectric module 10 according to the presentembodiment, the sealing member 8 is disposed between the peripheralportion of the first region 11 and the principal surface of the secondsupport substrate 2 so as to surround the thermoelectric elements 3, andthe thermally conductive member 5 is in contact with the sealing member8. In general, when the thermoelectric module 10 is used, a temperaturedifference occurs between the first support substrate 1 and the secondsupport substrate 2. Therefore, the thermoelectric elements 3 and thesealing member 8, which are disposed between the first support substrate1 and the second support substrate 2, try to deform into a distortedshape. Since the sealing member 8 and the thermally conductive member 5are in contact with each other, deformation of a portion of the sealingmember 8 that is in contact with the thermally conductive member 5 canbe suppressed. Since the deformation of the sealing member 8 issuppressed, the long-term reliability of the thermoelectric module 10can be increased.

In addition, in the thermoelectric module 10 according to the presentembodiment, the contact surface between the thermally conductive member5 and the sealing member 8 is curved. Accordingly, even when a thermalstress is generated between the sealing member 8 and the thermallyconductive member 5, since the area of the contact surface is greaterthan that in the case where the contact surface is flat, the generatedthermal stress can be distributed over a large area. Thus, the sealingmember 8 and the thermally conductive member 5 are deformed by a smallamount over a large area, so that the deformation of the sealing member8 can be suppressed and the thermal stress can be absorbed. As a result,the long-term reliability of the thermoelectric module 10 can beincreased.

In addition, in the thermoelectric module 10 according to the presentembodiment, the above-described contact surface is a curved surface thatis concave toward the sealing member 8. More specifically, the contactsurface has an arc shape that is concave toward the sealing member 8 incross section. The depth of the concavely curved surface may be set to,for example, about 0.3 to 1.5 mm. The temperature detection element 4,which is composed of a PTC thermistor, has characteristics such that itexpands when the temperature becomes greater than or equal to thethreshold. When the temperature detection element 4 thermally expands,the thermally conductive member 5, which covers the temperaturedetection element 4, also deforms. Since the contact surface between thethermally conductive member 5 and the sealing member 8 is concave towardthe sealing member 8, local concentration of the thermal stress on thecontact surface between the thermally conductive member 5 and thesealing member 8 can be suppressed. As a result, the long-termreliability of the thermoelectric module 10 can be increased.

The thermally conductive member 5 preferably has a modulus of elasticityhigher than that of the sealing member 8. In such a case, when thesealing member 8 tries to deform, the deformation can be suppressed bythe thermally conductive member 5. As a result, deformation of thethermoelectric module 10 can be suppressed in heat cycles. The modulusof elasticity of the thermally conductive member 5 may be set to, forexample, about 4 MPa, and the modulus of elasticity of the sealingmember 8 may be set to, for example, about 1.7 MPa.

Although the first support substrate 1 and the second support substrate2 both have a rectangular shape in the thermoelectric module 10according to the present embodiment, their shapes are not limited tothis. The shapes of the first support substrate 1 and the second supportsubstrate 2 may be changed as appropriate in accordance with thestructure of an external member to which the thermoelectric module 10 isattached. More specifically, the first support substrate 1 and thesecond support substrate may have a polygonal shape other than arectangular shape, a circular shape, or an elliptical shape.

As illustrated in FIG. 6, the temperature detection element 4 may have atop surface, and the top surface of the temperature detection element 4may be located above the bottom surface of the second support substrate2. When the top surface of the temperature detection element 4 islocated above the bottom surface of the second support substrate 2, aside surface of the second support substrate 2 may be disposed near aside surface of the temperature detection element 4. Accordingly, heatcan be more quickly transferred between the temperature detectionelement 4 and the second support substrate 2. The vertical distancebetween the top surface of the temperature detection element 4 and thebottom surface of the second support substrate 2 may be set to, forexample, about 0.1 to 3 mm.

As illustrated in FIG. 7, in addition to the temperature detectionelement 4 and the second support substrate 2 being thermally connectedto each other by the thermally conductive member 5, the temperaturedetection element 4 and the second support substrate 2 may be in contactwith each other. In such a case, heat can not only be transferred fromthe second support substrate 2 to the temperature detection element 4through the thermally conductive member 5, but also be directlytransferred from the second support substrate 2 to the temperaturedetection element 4. As a result, heat can be more quickly transferredbetween the temperature detection element 4 and the second supportsubstrate 2. Preferably, a side surface of the temperature detectionelement 4 and a side surface of the second support substrate 2 are insurface contact with each other. In such a case, the contact areabetween the temperature detection element 4 and the second supportsubstrate 2 can be increased, so that heat can be more quicklytransferred between the temperature detection element 4 and the secondsupport substrate 2.

EXAMPLES

The thermoelectric module 10 according to the present invention will bedescribed in further detail by referring to examples. First, the firstsupport substrate 1 having the first electrode 6 on the top surfacethereof and the second support substrate 2 having the second electrode 7on the bottom surface thereof were prepared, and the thermoelectricelements 3 were arranged between the first support substrate 1 and thesecond support substrate 2. A substrate obtained by bonding a copperplate to the bottom surface of an epoxy resin plate to which aluminafiller was added was used as the first support substrate 1. Similarly, asubstrate obtained by bonding a copper plate to the top surface of anepoxy resin plate to which alumina filler was added was used as thesecond support substrate 2. The thickness of each epoxy resin plate was80 μm, and the thickness of each copper plate was 120 μm. The firstelectrode 6 and the second electrode 7 were made of copper. Thethickness of the copper was 105 μm.

The thermoelectric elements 3 were arranged between the first region 11of the first support substrate 1 and the second support substrate 2, andwere bonded to the first electrode 6 and the second electrode 7. Thethermoelectric elements 3 had a columnar shape with a diameter of 1.8 mmand a height of 1.6 mm. The thermoelectric elements 3 were bonded to thefirst electrode 6 and the second electrode 7 with solder.

Next, the sealing member 8 was provided so as to surround thethermoelectric elements 3 in the space between the first region 11 ofthe first support substrate 1 and the second support substrate 2. Anepoxy resin was used as the sealing member 8.

The temperature detection element 4 was provided on the top surface ofthe first support substrate 1 in the second region 12, which is a regionoutside the sealing member 8. A PTC thermistor was used as thetemperature detection element 4. Then, the thermally conductive member 5was arranged such that the thermally conductive member 5 was in contactwith both the temperature detection element 4 and the second supportsubstrate 2, so that the temperature detection element 4 and the secondsupport substrate 2 were thermally connected to each other. A siliconeresin was used as the thermally conductive member 5. Thus, an example ofthe thermoelectric module 10 according to the present invention(Sample 1) was manufactured. As a comparative example, a thermoelectricmodule without the thermally conductive member 5 (Sample 2) was alsoproduced.

Next, Samples 1 and 2 were evaluated. To simulate a case where abnormalheating has occurred at a side of the thermoelectric elements 3 adjacentto the second support substrate 2, a heater was attached to the topsurface of the second support substrate 2. Next, the heater was causedto generate heat so that the second support substrate 2 was heated, andthe time required for the temperature detection element 4 to detect thetemperature change was measured. More specifically, the temperature ofthe heater was increased from a normal temperature (20° C.) to 90° C. in5 seconds. It was assumed that the temperature detection element 4detected the temperature change when the electrical resistance of thetemperature detection element 4 increased by 5%. The time from when theheater started to increase the temperature to when the temperaturedetection element 4 detected the temperature change was measured. Thetime from when the heater started to increase the temperature to whenthe temperature change was detected was 8 seconds for Sample 1, and 17seconds for Sample 2. It has been confirmed from the above-describedresults that, by providing the thermally conductive member 5 thatthermally connects the temperature detection element 4 and the secondsupport substrate 2 to each other, even when the temperature of thesecond support substrate 2 is changed, the temperature change can be canbe quickly detected.

REFERENCE SIGNS LIST

-   -   1 first support substrate    -   11 first region    -   12 second region    -   2 second support substrate    -   3 thermoelectric element    -   31 p-type thermoelectric element    -   32 n-type thermoelectric element    -   4 temperature detection element    -   5 thermally conductive member    -   6 first electrode    -   7 second electrode    -   8 sealing member    -   10 thermoelectric module

1. A thermoelectric module comprising: a first support substrateincluding a first region and a second region that is adjacent to thefirst region; a second support substrate facing the first region; aplurality of thermoelectric elements arranged between the first regionand the second support substrate; a temperature detection elementmounted in the second region; and a thermally conductive member, whereinthe temperature detection element is thermally connected to the secondsupport by the thermally conductive member.
 2. The thermoelectric moduleaccording to claim 1, wherein a sealing member is disposed between thefirst region and the second support substrate, the sealing membersurrounding the thermoelectric elements, and the thermally conductivemember is in contact with the sealing member.
 3. The thermoelectricmodule according to claim 2, wherein a contact surface between thethermally conductive member and the sealing member is a curved surface.4. The thermoelectric module according to claim 3, wherein the contactsurface is concave toward the sealing member.
 5. The thermoelectricmodule according to claim 2, wherein the thermally conductive member hasa higher modulus of elasticity than that of the sealing member.
 6. Thethermoelectric module according to claim 1, wherein the thermallyconductive member contains a resin material and thermally conductiveparticles having a higher thermal conductivity higher than that of theresin material.
 7. The thermoelectric module according to claim 1,wherein a top surface of the temperature detection element is locatedabove a bottom surface of the second support substrate.
 8. Thethermoelectric module according to claim 1, wherein the temperaturedetection element is in contact with the second support substrate.